Giga Connections inc. (GCI) Gold Plated Conductive Diamond (GPCD) Plating Service applies GPCD down to 1 um conductive diamond particles using a patented electroless plating process. The GPCD plating forms a superior, sharp, non-scrubbing multi-point diamond connection system that penetrates highly resistive surface oxide that forms on most metal surface. The GPCD does not wear out and can pierce any contaminants, resists oil and dirt contaminates. The resulting contact resistance is ~3-5 milliohms with no measurable inductance or capacitance. This controlled impedance material is electrically invisible, reduces contact force for a solder like electrical connection for repeatable instrument measurements, even after thousands of mate/de-mate probing cycles.
GCI can plate Conductive Diamonds on DC to >100Ghz instrument probe tips, manual test Probes, TDR Probes, Instrument Scope Probes, High Voltage Probes and Printed Circuit Boards (PCB’s) and other material from most Metals, Glass, Ceramic, FR4, Flex and Kapton Substrates for 3rd party designs. We can plate conductive diamonds on small run prototype designs as proof of concepts to evaluate if the plating process provides added value to your product’s functionality and reliability.
Benefits:
- Easily Penetrate Aluminum and Copper Oxide
- Repeatable Measurements in High Temperature Environments
- Reduce Contact Surface Resistance
- Improve Measurement Accuracy and Reliability
- Non-Scrubbing Sharp Multi-Point Diamond Connection
Other Services
Non-Destructive Die Extraction and Reassembly:
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Move die from plastic packages to rugged ceramic packages
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Reassemble previously removed die into any available package – plastic or ceramic
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Create Multi Chip Modules (MCM) from packaged IC
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Die Removal or " Die Harvesting" process does NOT induce damage to the die
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Locate Counterfeit circuitry in Die for Intellectual Property (IP) Verification and Litigation
Additional Packaging Services:
De-capping
Die Thinning
Full Service Packaging
Wire Bonding and Repair
Die Extraction for Prototype Development
GCI safely removes die from plastic and ceramic packages without damaging the die so that they can then be reassembled into a multichip module (MCM) or any other package using our proprietary Die removal processes.
Bond Wire Repair
GCI provides a quick turn bond wire repair service. If a bond wire was inadvertently missed or misbonded due to an incorrect wire bond diagram we will quickly repair it eliminating the need for waiting for a rebuild and saving money from purchasing a new package.
Conductive Diamond Interconnect Products
GCI has also developed a mechanical compliant conductive diamond interposer used in DC- 40GHz Design Verification Sockets or as a Board to Board interposer. These unique interposers provide interconnect bandwidth & return loss beyond 40 GHz and mimics a soldered connection. For example, a 672 BGA socket assembly typically requires only 2-3 inch lb torque on a single screw to achieve continuity on all balls. All socket designs can be sized to meet specific pin counts beyond 2000 balls. The typical 1% impedance interconnect discontinuity is similar to a soldered junction, such that for Gigabit applications, makes an excellent replacement for RF pogo pin or spring type socket architectures.
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| Giga Connections, Inc Clean Room |
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Conductive Diamond Plating Service
Benifits:
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Easily Penetrate Aluminum and Copper Oxide
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Repeatable Measurements in High Temperature Environments
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Reduce Contact Surface Resistance
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Improve Measurement Accuracy and Reliability
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Non-Scrubbing Sharp Multi-Point Diamond Connection
Giga Connections inc. Gold Plated Conductive Diamond (GPCD) Plating Service apply GPCD particles down to 1 um on DC to >100Ghz instrument probe tips made from most metals, glass or ceramic using a patented electroless plating process. The GPCD plating forms a superior, sharp, non-scrubbing multi-point diamond connection system that penetrates highly resistive surface oxide that forms on most metal surface. The GPCD does not wear out and can pierce any contaminants, resists oil and dirt contaminates. The resulting contact resistance is ~3-5 milliohms with no measurable inductance or capacitance. This controlled impedance material is electrically invisible, reduces contact force for a solder like electrical connection for repeatable instrument measurements, even after thousands of mate/de-mate probing cycles.
We Apply Conductive Diamonds Plating on:
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| Conductive Diamond Plated Instrument Probes |
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Types of Probes GCI can plate with Conductive Diamonds:
- Manual Test Probes
- Oscilloscope Instrument Probes
- TDR Probes
- Micro Probes
- High Voltage Test Probes
Functional Benefits of Plating Probes with Conductive Diamonds: Creates a Non Scrubbing Sharp Multi-Point Diamond Connection. The conductive diamonds reduces the probing footprint and cuts through resistive oxide. Excellent for High Temperature probing for Accelerated Testing. Provides repeatable high bandwidth measurements when conductive diamonds on applied to oscilloscope instrument probes, reduces probing force, enables probing at Any angle, the probe tip does dull or wear out and the surface can be cleaned with common oxide remover solvents.
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| Semiconductor Die Extraction & Repair |
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| Giga Connections, Inc. (GCI) performs a wide variety of specialized engineering services for semiconductor applications.
Die Extraction for Prototype Development
GCI safely removes die from plastic and ceramic packages without damaging the die so that they can then be reassembled into a multichip module (MCM) or any other package using our proprietary Die removal processes. For example, moving die from plastic packages to ceramic packages extends the usable lifetime of an IC typically by 10X to 20X at 185C.
Bond Wire Repair
GCI provides a quick turn bond wire repair service. If a bond wire was inadvertently missed or misbonded due to an incorrect wire bond diagram we will quickly repair it eliminating the need for waiting for a rebuild and saving money from purchasing a new package.
CYCLE TIME:
Our standard cycle is three days although this can be expedited to a two-day, one-day or in some cases same-day turns if required. In a same-day turn, we receive packages with an early-AM FedEx delivery and we will FedEx out the die later that same day
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| Products Containing Conductive Diamond Plating Technology |
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| Conductive Diamond Test Socket Interposers |
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| Conductive Diamond Plated Flex |
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| DC-40GHZ Test Sockets |
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| 30GHz TDR probe with Gold Plated Conductive Diamond Probe Tips. Probe body has been plated with Nickel |
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| 200 um zoom of probe tips with Conductive Diamonds |
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| DVT Solutions partnered with Giga Connections, Inc. to plate their 30GHz Differential TDR probe. Probe tip does not oxidize, probe at any angle and still makes excellent high bandwidth connection. Worlds 1st Gold Plated Conductive test probe |
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