Conductive Diamond Plated Flex Circuits
Fine Pitch Capability
Contact Point Size is 5 um; 100 um Pitch can be Achieved
Board-to-Board Interconnects
Seamless Jumpers
Multi-Bump Contact Array
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Giga Connections, inc. partners with PCB manufactures to offer a service to plate their interconnect contact portion with Conductive Diamond Plating (CDP). The CDP is electrically invisible, and due to the low discontinuity, it extends the bandwidth s-parameters of any flex or PCB design over traditional interconnects such as gold on gold or spring contact. Giga Connections, Inc. also provides a turn-key service/solution(s), working with designers/customers to provide a total product solution. Our CDP process has superior signal integrity to 40 GHz and meets military and commercial environmental specifications; the cost is competitive with most interconnect plating technologies.
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General Conductive Diamond Plating Specifications
> 40 GHZ bandwidth
Gold plated 25 to 30 micro-inches of hard gold (standard). Tin or solder plating is available. Contact surface can be refurbished.
>10's of thousands of insertions without measurable degradation in signal integrity.
As little as 10 Grams force requirement to achieve connection.
Current handling for 10 mil diameter pad is ~15 amps.
No inductance, no capacitance, ~1 % increase in impedance.
(DP) Material can be designed to withhold up to 26 G’s of shock and vibration.
Temperature dependence is determined by the substrate material:
-40C to 150C for FR4
-60C to 200 for Kapton film
-250C to 400C on crystalline (ceramic or silicon) substrate.
Contact point size is 5um; 4-mil pitch can be achieved.
RoHs compliance- lead free
Ability to solder or glue substrate to PCB for permanent connection using patented Diamond Adhesive Technology
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| Flex Circuit with Conductive Diamonds Plating |
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This flex circuit center pads have been plated with Conductive Diamonds. The edge connector pads have been masked and are not plated. This example demonstrates our ability to selectively plate Conductive Diamonds, making the process more economical.
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| Conductive Diamond Plating is a Delphi Gold Dot Replacement |
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| Delphi Gold Dot Interconnect |
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“Gold Dot” |
“Diamond Plate” |
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0.5 um Pitch |
0.1 um Pitch/
Self-Aligning |
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2.5 GHz Applications |
40+ GHz Applications |
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Metal Based Substrate Core |
Diamond Based Substrate Core |
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Typically One Contact Point |
10’s to 100’s of Contact Points |
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Solderless/
Lead-Free |
Solderless/
Lead-Free |
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